📌 Fellowship_research

PostDoc Position on Wafer Bonding Physics, University of Twente, Netherlands

Offered by ResearchersJob

📋 About This Opportunity

Summary The University of Twente is offering a challenging 2-year postdoctoral position in the XUV Optics group. The successful candidate will investigate the detailed physics behind wafer bonding for next-generation 3D chip integration, combining surface science, advanced metrology, and semiconductor process This opportunity was collected by Gabeshana from ResearchersJob. Organization: ResearchersJob. Please visit the original source for complete eligibility requirements, official notification, application instructions and the latest information.

🎯 Eligibility

/QualificationYour ProfilePhD degree in materials science, surface science, applied physics, physical chemistry, nanotechnology, mechanical engineering, or a related field.Experience with experimental research on surfaces, interfaces, thin films, wafer processing, adhesion, or semiconductor-related materials.Familiarity with one or more relevant characterization techniques, such as AFM, WLI, contact-angle measurements, XPS, FTIR, infrared metrology, ellipsometry, or related surface-analysis methods.Interest in connecting experimental results to physical models and quantitative data analysis.Enjoy hands-on experimental work and ability to work accurately with advanced laboratory equipment.Cre

Important: Always verify the opportunity details, eligibility requirements and application process from the official source before submitting your application.